LED PCB Assembly Capabilities
Casyoo delivers precise and reliable LED PCB assembly services, ensuring superior performance for every project. With advanced equipment and extensive expertise in LED technology, we handle complex assemblies with utmost accuracy.
LED PCB Assembly
LED Controller Assembly
LED Driver Assembly
Complete Lighting Assembly
Our Capabilities for LED PCB
With advanced equipment and extensive expertise in LED technology, SMT, through-hole technology, and mixed technology, we handle complex LED assemblies with utmost accuracy. Whether you need LED prototyping or large-scale production, Casyoo guarantees exceptional quality results.
LED PCB Capabilities Overview
| PCB layers | 1-18 layers |
| Board materials | FR-4, CEM-1, CEM-3, RCC, metal, ceramic, aluminum... |
| Board Size | Up to 22"×47" for double-sided PCB |
| PCB thickness | 0.0315", 0.0394", 0.0472" (based on different layers) |
| Outer layer copper thickness | 0.5-5 OZ |
| Inner layer copper thickness | 0.5-2 OZ |
| Min trace width | 4mil |
| PCB via diameter | 0.006-0.098 |
LED PCBA Capabilities Overview
| Assembly options | SMT, THT, hybrid of both |
| Component procurement | Full& partial turnkey, consigned/kitted |
| Assembly facilities | 8 SMT lines + 5 DIP production lines |
| Solder types | Leaded and lead-free assembly |
| Stencils | Nano-coating, Laser-cut stainless steel |
| Repair & Rework | Ball Grid Array replacement, IR rework |
| Min trace width | 4mil |
| Lead Time | as fast as 24 hours for simple assembly |
Detail LED PCB Assembly Capabilities
Feature
Assembly options
Minimum Trace Width
PCB size
Board type
Component Types
Production Capacity
Lead Time
Testing Methods
Certifications
Procurement Models
Repair & Rework
Specification
SMT, THT, hybrid of both
4mil
50×50mm—650×370mm
Rigid, flexible boards, multilayer PCB
Smallest to 0201; Supports BGA, QFN, QFP, Flip Chip, PLCC, etc.
Up to 8 Million SMT placements/month
3.8 Million DIP components/month
1–3 days for prototypes, 7–15 days for mass production
AOI, X-ray Inspection, In-Circuit Test, Functional Test
ISO9001, ISO14485, IPC-2010, UL
Full & Partial Turnkey, Consigned/kitted
Ball Grid Array replacement, IR rework
